Connecting and Encapsulation Technology for Active Middle...

Biomedical Engineering/ Biomedizinische Technik 2012 / 01 Vol. 57; Iss. SI-1 Track

Connecting and Encapsulation Technology for Active Middle Ear Implants

Tavakoli, K., Kaltenbacher, D., Winter, M., Zenner, H-P., Burkhardt, C.
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Volume:
57
Language:
english
Journal:
Biomedical Engineering / Biomedizinische Technik
DOI:
10.1515/bmt-2012-4440
Date:
January, 2012
File:
PDF, 59 KB
english, 2012
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