Solderability and Interfacial Intermetallic Compound (IMC)...

Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium

Mohd Sobri, Fatin Afeeqa, Mohd Salleh, Mohd Arif Anuar, Ghazali, Che Mohd Ruzaidi, Narayanan, Pavithiran
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
857
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.857.8
Date:
May, 2016
File:
PDF, 1.67 MB
english, 2016
Conversion to is in progress
Conversion to is failed