![](/img/cover-not-exists.png)
Solderability and Interfacial Intermetallic Compound (IMC) Growth of Sn-Cu-Ni Solder with Additions of Germanium
Mohd Sobri, Fatin Afeeqa, Mohd Salleh, Mohd Arif Anuar, Ghazali, Che Mohd Ruzaidi, Narayanan, PavithiranVolume:
857
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.857.8
Date:
May, 2016
File:
PDF, 1.67 MB
english, 2016