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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 µm Pitch SnAg Solder 3-D Interconnections
Sakuma, Katsuyuki, Webb, Buck, Liu, Xiao Hu, Knickerbocker, John, Weiss, Thomas, Li, Shidong, Zhang, Hongqing, Thomas, Conor R., Perfecto, Eric, Xu, Tingge, Lu, HongbingYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.191
File:
PDF, 2.72 MB
english, 2016