[IEEE 2016 IEEE 66th Electronic Components and Technology...

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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Thermocompression Bonding Process Design and Optimization for Warpage Mitigation of Ultra-Thin Low-CTE Package Assemblies

Jayaram, Vidya, McCann, Scott, Huang, Ting-Chia, Kawamoto, Satomi, Pulugurtha, Raj, Smet, Vanessa, Tummala, Rao
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Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.384
File:
PDF, 521 KB
english, 2016
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