[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Effect of Epoxy Flux Underfill on Thermal Cycling Reliability of Sn-8Zn-3Bi Lead-Free Solder in a Sensor Application
Mostofizadeh, M., Najari, M., Das, D., Pecht, M., Frisk, L.Year:
2016
Language:
english
DOI:
10.1109/ectc.2016.209
File:
PDF, 901 KB
english, 2016