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Microstructure formation and evolution mechanism of Cu-Ti coating during dual-magnetron sputtering and thermo plasma nitriding
Zhu, Y.D., Yan, M.F., Zhang, Y.X., Chen, H.T., Yang, Y.Volume:
134
Language:
english
Journal:
Vacuum
DOI:
10.1016/j.vacuum.2016.09.008
Date:
December, 2016
File:
PDF, 1.66 MB
english, 2016