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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Die Attach Material for Power Semiconductor Having Nano-Level Sn-Cu Diffusion Control
Ikeda, Hiroaki, Sekine, Shigenobu, Kimura, Ryuji, Shimokawa, Koichi, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Tamaki, Rei, Nagata, MakotoYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.122
File:
PDF, 1.23 MB
english, 2016