![](/img/cover-not-exists.png)
[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Copper Ball Bond over a Variety of Probe Marks in Two Pad Aluminum Thicknesses
Marsh, Jacob, Doutre, Austin, Syndergaard, Kyle, Brown, Priscila, Hoo, Kok Inn, Jesus, Edsel De, Hunter, StevanYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.382
File:
PDF, 417 KB
english, 2016