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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications
Weber, Constanze, Walter, Hans, Dijk, Marius Van, Hutter, Matthias, Wittler, Olaf, Lang, Klaus-DieterYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.394
File:
PDF, 918 KB
english, 2016