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Influence of Complexing Agents on Adhesion Strength of Electroless Nickel–Phosphorus Plating to Silicon Nitride–Aluminum–Polyimide Mixed Substrates
Arakawa, Tomiyuki, Watanabe, Nobuaki, Nakada, Tatsunosuke, Oshikiri, Junki, Umemoto, Hiroshi, Hashimoto, Akira, Koiwa, IchiroVolume:
87
Language:
english
Journal:
Bulletin of the Chemical Society of Japan
DOI:
10.1246/bcsj.20130282
Date:
May, 2014
File:
PDF, 2.26 MB
english, 2014