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A Study on Through-Silicon-via Using Tri-Block Copolymer and Pulse Electroplating
Son, Hwa-Jin, Kim, Tae-Yoo, Suh, Su-JeongVolume:
16
Language:
english
Journal:
Journal of Nanoscience and Nanotechnology
DOI:
10.1166/jnn.2016.12485
Date:
August, 2016
File:
PDF, 3.80 MB
english, 2016