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Optimization of contact metallizations for reliable wafer level AuSn bonds
Vuorinen, V., Rautiainen, A., Heikkinen, H., Paulasto-Kröckel, M.Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.013
Date:
September, 2016
File:
PDF, 1.79 MB
english, 2016