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Microelectronics Reliability 2016 / 9

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests

Mavinkurve, A., Martinez, J.L.M. Llacer, van Soestbergen, M., Zaal, J.J.M.
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.105
Date:
September, 2016
File:
PDF, 1007 KB
english, 2016
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