Reliability aspects of copper metallization and...

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Microelectronics Reliability 2016 / 9

Reliability aspects of copper metallization and interconnect technology for power devices

Hille, Frank, Roth, Roman, Schäffer, Carsten, Schulze, Holger, Heuck, Nicolas, Bolowski, Daniel, Guth, Karsten, Ciliox, Alexander, Rott, Karina, Umbach, Frank, Kerber, Martin
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.119
Date:
September, 2016
File:
PDF, 3.15 MB
english, 2016
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