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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology
Lin, Yaojian, Kang, Chen, Chua, Linda, Choi, Won Kyung, Yoon, Seung WookYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.257
File:
PDF, 563 KB
english, 2016