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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - A computational study of PCB layer orientation of WCSP assembly under temperature dependent drop impact loading
Mahmood, Anik, Barua, Trina, Sabne, Saylalee, Sakib, A R Nazmus, Agonafer, DerejeYear:
2016
Language:
english
DOI:
10.1109/ITHERM.2016.7517585
File:
PDF, 1.21 MB
english, 2016