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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation
Qiming Zhang,, Lo, Jeffery C. C., Lee, S. W. Ricky, Wei Xu,, Weihua Yang,Year:
2016
Language:
english
DOI:
10.1109/ITHERM.2016.7517700
File:
PDF, 916 KB
english, 2016