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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations
Tunga, Krishna, Wassick, Thomas, Guerin, Luc, Cournoyer, MaryseYear:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517526
File:
PDF, 396 KB
english, 2016