[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - 2.5D methodologies for electronic package and PCB modeling: Review and latest development
Liu, En-Xiao, Wei, Xing-Chang, Li, Er-PingYear:
2016
Language:
english
DOI:
10.1109/ISEMC.2016.7571752
File:
PDF, 1.03 MB
english, 2016