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[IEEE 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Prague, Czech Republic (2016.6.12-2016.6.16)] 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Development of heat sink integrated transfer molded power modules with Thermal Conductive Insulating Sheet
Yamamoto, Kei, Rokubuichi, Hodaka, Nishimura, Takashi, Hiramatsu, Seiki, Nakajima, Dai, Kitai, Kiyofumi, Goto, YoichiYear:
2016
DOI:
10.1109/ISPSD.2016.7520880
File:
PDF, 472 KB
2016