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[IEEE 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Prague, Czech Republic (2016.6.12-2016.6.16)] 2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Novel IGBT modules with epoxy resin encapsulation and insulating metal baseplate
Kaji, Yusuke, Hatanaka, Yasumichi, Hiramatsu, Seiki, Kondo, Satoshi, Asada, Shinsuke, Otsubo, YoshitakaYear:
2016
Language:
english
DOI:
10.1109/ISPSD.2016.7520881
File:
PDF, 816 KB
english, 2016