An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base Plate Solder Fatigue
Li, Hui, Hu, Yaogang, Liu, Shengquan, Li, Yang, Liao, Xinglin, Liu, ZhixiangYear:
2016
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2016.2606483
File:
PDF, 932 KB
english, 2016