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[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array
Drummond, Kevin P., Weibel, Justin A., Garimella, Suresh V., Back, Doosan, Janes, David B., Sinanis, Michael D., Peroulis, DimitriosYear:
2016
Language:
english
DOI:
10.1109/itherm.2016.7517565
File:
PDF, 1.93 MB
english, 2016