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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - TGV (Thru-Glass Via) Metallization by Direct Cu Plating on Glass
Onitake, Shigeo, Inoue, Kotoku, Takayama, Masatoshi, Kozuka, Takashi, Kuramochi, Satoru, Yun, HobieYear:
2016
Language:
english
DOI:
10.1109/ECTC.2016.231
File:
PDF, 625 KB
english, 2016