A new 3D chip cooling technology using micro-channels thermosyphon with super-moist fluids and nanofluids
Zhang, Kai-lun, Liu, Zhen-Hua, Zheng, Bao-chenVolume:
128
Language:
english
Journal:
Energy Conversion and Management
DOI:
10.1016/j.enconman.2016.09.065
Date:
November, 2016
File:
PDF, 1.42 MB
english, 2016