A new 3D chip cooling technology using micro-channels...

A new 3D chip cooling technology using micro-channels thermosyphon with super-moist fluids and nanofluids

Zhang, Kai-lun, Liu, Zhen-Hua, Zheng, Bao-chen
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Volume:
128
Language:
english
Journal:
Energy Conversion and Management
DOI:
10.1016/j.enconman.2016.09.065
Date:
November, 2016
File:
PDF, 1.42 MB
english, 2016
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