Rolling Resistance and Mechanical Properties of Grinded...

Rolling Resistance and Mechanical Properties of Grinded Copper Surfaces Using Molecular Dynamics Simulation

Liang, Shih-Wei, Wang, Chih-Hao, Fang, Te-Hua
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Volume:
11
Language:
english
Journal:
Nanoscale Research Letters
DOI:
10.1186/s11671-016-1616-1
Date:
December, 2016
File:
PDF, 2.48 MB
english, 2016
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