Rolling Resistance and Mechanical Properties of Grinded Copper Surfaces Using Molecular Dynamics Simulation
Liang, Shih-Wei, Wang, Chih-Hao, Fang, Te-HuaVolume:
11
Language:
english
Journal:
Nanoscale Research Letters
DOI:
10.1186/s11671-016-1616-1
Date:
December, 2016
File:
PDF, 2.48 MB
english, 2016