[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Modeling and analysis of high-speed through silicon via (TSV) channel and defects
Jung, Daniel H., Kim, Jonghoon J., Kim, Heegon, Choi, Sumin, Lim, Jaemin, Kim, Joungho, Bae, Hyun-Cheol, Choi, Kwang-SeongYear:
2016
Language:
english
DOI:
10.1109/ISEMC.2016.7571686
File:
PDF, 643 KB
english, 2016