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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of Encapsulant Material for Molded Underfil for Fine Pitch Flip Chip Packages
Tsuji, Takayuki, Akashi, Takahiro, Watanabe, Naoki, Nishidono, Kyoko, Nakamura, MasashiYear:
2016
Language:
english
DOI:
10.1109/ECTC.2016.260
File:
PDF, 1.12 MB
english, 2016