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Mixed ink of copper nanoparticles and copper formate complex with low sintering temperatures
Li, Yan, Qi, Tianke, Chen, Miao, Xiao, FeiVolume:
27
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-016-5269-8
Date:
November, 2016
File:
PDF, 1.44 MB
english, 2016