[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - High efficiency power solutions by chip embedding
Essig, Kay S, Chiu, CT, Kuo, Jarris, Chen, Phidia, Yannou, Jean-MarcYear:
2016
Language:
english
DOI:
10.1109/3DPEIM.2016.7570575
File:
PDF, 6.51 MB
english, 2016