Tensile fracture of integrated single-crystal silicon...

Procedia Structural Integrity 2016 Vol. 2

Tensile fracture of integrated single-crystal silicon nanowire using MEMS electrostatic testing device

Tsuchiya, Toshiyuki, Hemmi, Tetsuya, Suzuki, Jun-ya, Hirai, Yoshikazu, Tabata, Osamu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
2
Year:
2016
Language:
english
Journal:
Procedia Structural Integrity
DOI:
10.1016/j.prostr.2016.06.178
File:
PDF, 1.06 MB
english, 2016
Conversion to is in progress
Conversion to is failed