[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints

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