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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Design, Demonstration and Characterization of Ultra-Thin Low-Warpage Glass BGA Packages for Smart Mobile Application Processor
Shi, Tailong, Chou, Bruce, Huang, Ting-Chia, Ogawa, Tomonori, Sato, Yoichiro, Matsuura, Hiroyuki, Kawamoto, Satomi, Sundaram, Venky, Panayappan, Kadappan, Smet, Vanessa, Tummala, RaoYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.372
File:
PDF, 642 KB
english, 2016