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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder interconnects
Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-PingYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583288
File:
PDF, 1.65 MB
english, 2016