Thermally-induced failures of copper through-silicon via...

Thin Solid Films 2016 / 09 Vol. 615

Thermally-induced failures of copper through-silicon via structures evaluated by the strain energy density model

Han, Chang-Fu, Lin, Jen-Fin
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Volume:
615
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2016.07.038
Date:
September, 2016
File:
PDF, 1.86 MB
english, 2016
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