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Microelectronics Reliability 2016 / 9

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis

Khaled, A., Brand, S., Kögel, M., Appenroth, T., De Wolf, I.
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Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.07.061
Date:
September, 2016
File:
PDF, 1018 KB
english, 2016
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