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Micromechanical model for describing intergranular fatigue cracking in a lead-free solder alloy
Le, V.N., Benabou, L., Etgens, V., Tao, Q.B.Volume:
2
Year:
2016
Language:
english
Journal:
Procedia Structural Integrity
DOI:
10.1016/j.prostr.2016.06.327
File:
PDF, 1.57 MB
english, 2016