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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Thermal modeling and analysis on a novel no-substrate LEDCOB module
Nie, Yaoyao, Yang, D.G., Cai, Miao, Liu, Dongjing, Mo, YuezhuYear:
2016
Language:
english
DOI:
10.1109/ICEPT.2016.7583204
File:
PDF, 933 KB
english, 2016