[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of Highly Thermal Conductive Adhesive Film for High Performance Power Modules
Komatsu, Fumikazu, Aoki, Issei, Sato, Jyunya, Takasugi, Hiroshi, Teraki, ShinYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.47
File:
PDF, 948 KB
english, 2016