![](/img/cover-not-exists.png)
Application of Self-Assembled Monolayers to the Electroless Metallization of High Aspect Ratio Vias for Microelectronics
Bernasconi, R., Molazemhosseini, A., Cervati, M., Armini, S., Magagnin, L.Volume:
45
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-016-4753-5
Date:
October, 2016
File:
PDF, 1.42 MB
english, 2016