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[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - 450mm Cu single damascene BEOL process with 20nm half-pitched features
Sunoo Kim,, Dunn, Shannon, Smith, Steven, Collision, WenLi, Prudhomme, Jamie, Huey-Ming Wang,, Maniscalco, Joe, Yathapu, Nithin, Chulgi Song,, Wang, Barry, Carr, Christopher, Hsi-Wen Liu,, Gall, BYear:
2016
Language:
english
DOI:
10.1109/IITC-AMC.2016.7507638
File:
PDF, 776 KB
english, 2016