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[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Materials science of Ru and Ru alloy thin films for barrier applications

Liao, Wen, Bost, Daniel, Chia-Yun Chiu,, Hwang, Gyeong S., Ekerdt, John G.
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Year:
2016
Language:
english
DOI:
10.1109/IITC-AMC.2016.7507697
File:
PDF, 464 KB
english, 2016
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