[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Post porosity plasma protection integration at 48 nm pitch
Huai Huang,, Lionti, Krystelle, Volksen, Willi, Spooner, Terry, Shobha, Hosadurga, Lee, Joe, Chen, James Hsueh-Chung, Magbitang, Teddie, Peethala, Brown, Liniger, Eric G, Chao Kun Hu,, Huang, ElbertYear:
2016
Language:
english
DOI:
10.1109/IITC-AMC.2016.7507715
File:
PDF, 116 KB
english, 2016