[IEEE 2016 IEEE International Interconnect Technology...

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[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Characterization of Advanced Sequential Flow Deposition (ASFD) TiON electrode in MIM structure for leakage current reduction

Ishizaka, Tadahiro, Koizumi, Masaki, Sano, Masaki, Seokhyoung Hong,, Koizumi, Masato, Cheonsoo Han,, Akiyama, Koji, Aoki, Sara, Shiraga, Kentaro, Tanimura, Tatsuhiko
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Year:
2016
Language:
english
DOI:
10.1109/IITC-AMC.2016.7507724
File:
PDF, 704 KB
english, 2016
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