Low-Temperature Bonding of Bi0.5Sb1.5Te3Thermoelectric...

Metallurgical and Materials Transactions A 2016 / 9 Vol. 47; Iss. 9

Low-Temperature Bonding of Bi0.5Sb1.5Te3Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer

Lin, Yan-Cheng, Yang, Chung-Lin, Huang, Jing-Yi, Jain, Chao-Chi, Hwang, Jen-Dong, Chu, Hsu-Shen, Chen, Sheng-Chi, Chuang, Tung-Han
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Volume:
47
Language:
english
Journal:
Metallurgical and Materials Transactions A
DOI:
10.1007/s11661-016-3641-1
Date:
September, 2016
File:
PDF, 2.22 MB
english, 2016
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