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Construction of a 3D porous network of copper film via a template-free deposition method with superior mechanical and electrical properties for micro-energy devices
Peng, Yuncheng, Wang, Yao, Deng, YuanVolume:
3
Language:
english
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/3/8/085014
Date:
August, 2016
File:
PDF, 5.22 MB
english, 2016