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[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Novel packaging and thermal measurement for 3D heterogeneous stacks
Harris, T. Robert, Davis, W. Rhett, Franzon, PaulYear:
2016
Language:
english
DOI:
10.1109/3DPEIM.2016.7570543
File:
PDF, 5.88 MB
english, 2016