[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Increase power density and simplify designs with 3D SiP modules
Moss, Jim, Chaudhry, Usman, Kummerl, Steven, DeVries, CharlesYear:
2016
Language:
english
DOI:
10.1109/3DPEIM.2016.7570577
File:
PDF, 4.59 MB
english, 2016