[IEEE 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Budapest, Hungary (2016.5.30-2016.6.2)] 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Characterization of LPCVD SiC thin films at elevated temperatures for robust MEMS sensor applications
Rusanov, Radoslav, Franziska, Rohlfing, Graf, Juergen, Rank, Holger, Fuchs, Tino, Kraft, OliverYear:
2016
Language:
english
DOI:
10.1109/DTIP.2016.7514833
File:
PDF, 1.50 MB
english, 2016