[IEEE 2016 Symposium on Design, Test, Integration and...

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[IEEE 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Budapest, Hungary (2016.5.30-2016.6.2)] 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Characterization of LPCVD SiC thin films at elevated temperatures for robust MEMS sensor applications

Rusanov, Radoslav, Franziska, Rohlfing, Graf, Juergen, Rank, Holger, Fuchs, Tino, Kraft, Oliver
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Year:
2016
Language:
english
DOI:
10.1109/DTIP.2016.7514833
File:
PDF, 1.50 MB
english, 2016
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