[IEEE 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Budapest, Hungary (2016.5.30-2016.6.2)] 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - Thermal humidity reliability criterions for a typical TSV device
Lwo, Ben-Je, Teng, Chia-Liang, Huang, Zi-Yan, Tseng, Kuo-Hao, Tseng, Kun-FuYear:
2016
Language:
english
DOI:
10.1109/DTIP.2016.7514850
File:
PDF, 502 KB
english, 2016